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DesignCon2006

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    2019-10-12 08:19
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    发表于 2019-10-7 17:45:40 | 只看该作者 回帖奖励 |倒序浏览 |阅读模式
    1.DesignCon2006-1There is an ongoing interest in refining the simulation models for passive components in electronic
    circuits. For simple analyses, bypass capacitors are modeled by a series C-R-L equivalent network. To
    capture the frequency dependency of the circuit parameters, more complex equivalent circuits can be
    used: ladder L-R networks to model the frequency dependent inductance and resistance and/or C-R
    networks to model the frequency dependent capacitance. These equivalent circuits have the advantage
    of being compatible with both time-domain and frequency domain SPICE simulations, but the optimum
    topology of the equivalent circuit may depend on the type and construction of capacitor. This paper first
    summarizes the current distributions inside MLCC parts simulated with a bedspring model and we make
    some counter-intuitive observations about the frequency dependency of inductance and resistance in tall
    MLCC parts. Based on those observations we then derive a slow-wave causal model, which represents
    the capacitor with a periodically loaded lossy transmission line. It is shown that the load circuit in the
    unit cell corresponds to the waveguide formed by two adjacent capacitor plates. The unit cells are
    further simplified and lumped together into one lossy, open-ended transmission line with a series R-L
    circuit capturing the impedance of the cover layer of the capacitor. The parameters of the single lossy
    transmission line are derived from the geometry and material properties. It is shown that the counterintuitive
    features in the model are captured by a virtual capacitance and dielectric loss tangent, which
    combine the dielectric loss of the ceramic and the resistive losses of the capacitor plates. The model is
    shown to capture the important characteristics of measured data, and it is simple enough to be used in
    multiple copies in circuit simulators.

    2.DesignCon2006-2
    Slow-Wave Causal Model for Multi Layer Ceramic Capacitors


    3.DesignCon2006-3

    Beyond the traditional components of conductive and dielectric losses, periodic discontinuities
    generate additional losses on interconnects. For instance, on printed-circuit boards (PCBs) and
    packages, periodic discontinuities may come from perforated planes and loading from regularly
    arranged via fields under large packages and sockets. There is an increased slope of attenuation
    with frequency due to periodic losses, with deeper resonant dips at frequencies where the
    periodic structure constructively lines up reflections. The frequencies where the dips occur are
    lower if the propagation delay between subsequent discontinuities is longer. The depth of the
    dips depends on how severe the discontinuities are. The paper provides measured and simulated
    data of this extra loss mechanism, together with simulated studies examining the impact of
    several geometrical parameters.



    4.DesignCon2006-4
    ATTENUATION IN PCB TRACES DUE TO PERIODIC DISCONTINUITES

    5.DesignCon2006-5
    Power Distribution Network (PDN) design of high-speed and high-power systems appears to be black
    magic: there are contradictory design philosophies, component selection and layout rules. Suboptimum
    or not proper power distribution increases the supply-rail noise, but this impacts system performance in
    a statistical manner, convoluted with many other variables. For this reason, over a wide range, different
    PDN designs may appear to perform equally well, giving rise to several misconceptions. This paper
    compares some of the popular board-level PDN design methods by their impedance profiles and worstcase
    transient noise. It is shown that smooth R-L type self-impedance profiles result in the lowest
    transient noise. Component placement is also analyzed, and it is concluded that bypass-capacitor
    location matters mostly in PDNs, where the impedance of the power/ground planes does not match the
    target impedance. Finally, measured impedance profiles are shown for some of the popular SUN
    servers, illustrating some of the possible PDN design philosophies.

    6.DesignCon2006-6
    This paper gives an overview of thin laminate applications at SUN’s Scalable Systems Groups, Horizontal
    Systems (formerly Volume Server Products) business unit. The paper summarizes some of the
    experimental engineering tests with various thin laminates on test boards and production boards, and gives
    a brief overview of the application of 1-mil laminates in a recent product.



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